PMMA spin coated and baked onto a silicon dioxide wafer in preparation for electron beam lithography.
       
     
 Evaporated gold electric contacts creating a graphene circuit. Large gold contacts are approximately 50 μm (0.0019685 inches)
       
     
 Hexagonal Boron Nitride laid on top of evaporated gold contacts creating a two dimensional graphene circuit.
       
     
 PPMA coated silicon surface with electron beam lithography etched windows exposing the substrate.
       
     
 PMMA spin coated and baked onto a silicon dioxide wafer in preparation for electron beam lithography.
       
     

PMMA spin coated and baked onto a silicon dioxide wafer in preparation for electron beam lithography.

 Evaporated gold electric contacts creating a graphene circuit. Large gold contacts are approximately 50 μm (0.0019685 inches)
       
     

Evaporated gold electric contacts creating a graphene circuit. Large gold contacts are approximately 50 μm (0.0019685 inches)

 Hexagonal Boron Nitride laid on top of evaporated gold contacts creating a two dimensional graphene circuit.
       
     

Hexagonal Boron Nitride laid on top of evaporated gold contacts creating a two dimensional graphene circuit.

 PPMA coated silicon surface with electron beam lithography etched windows exposing the substrate.
       
     

PPMA coated silicon surface with electron beam lithography etched windows exposing the substrate.